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  • Mini/Micro LED adhesive
    Suitable for Mini/Micro LED Displays
    URF series (Glass/PCB/FPC)
    White Reflective Solder Resist Ink
    Addresses problems with conventional reflective sheet punching and processing yields
    UV curing type
    Replacement for backlight module reflectors
    Adhesion ≥ 4B (@Glass/Cu foil/FR4)
    High reflectivity: Reflectivity ≥ 90% (@25 μm)
    IR-reflow resistance: b*<3 (@250°Cx10 min)
    High weather resistance: Low change in reflectivity, no yellowing
    UBM series
    Matte Black Matrix Resist
    High opacity and insulating properties
    UV curing type
    Suitable for piezoelectric printing
    Glass adhesion ≥ 4B
    Insulation properties: Surface resistance ≥ 1013 Ω/□
    High opacity: OD ≥ 3 (@100μm)
    Low surface gloss